The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2014

Filed:

Dec. 31, 2008
Applicants:

John Daniel Belnap, Pleasant Grove, UT (US);

Stewart N. Middlemiss, Salt Lake City, UT (US);

Anthony Griffo, The Woodlands, TX (US);

Thomas W. Oldham, The Woodlands, TX (US);

Kumar T. Kembaiyan, The Woodlands, TX (US);

Inventors:

John Daniel Belnap, Pleasant Grove, UT (US);

Stewart N. Middlemiss, Salt Lake City, UT (US);

Anthony Griffo, The Woodlands, TX (US);

Thomas W. Oldham, The Woodlands, TX (US);

Kumar T. Kembaiyan, The Woodlands, TX (US);

Assignee:

Smith International, Inc., Houston, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
E21B 10/567 (2006.01); B01J 3/06 (2006.01); B22F 7/06 (2006.01); C01B 31/06 (2006.01); C04B 35/52 (2006.01); C04B 35/645 (2006.01); C22C 1/05 (2006.01); C22C 26/00 (2006.01); E21B 10/56 (2006.01); E21B 10/573 (2006.01);
U.S. Cl.
CPC ...
E21B 10/567 (2013.01); B01J 3/065 (2013.01); B22F 7/06 (2013.01); C01B 31/065 (2013.01); C04B 35/52 (2013.01); C04B 35/645 (2013.01); C22C 1/058 (2013.01); C22C 26/00 (2013.01); E21B 10/56 (2013.01); E21B 10/5735 (2013.01); B01J 2203/062 (2013.01); B01J 2203/0655 (2013.01); B01J 2203/0685 (2013.01); B22F 2998/00 (2013.01); B22F 2998/10 (2013.01); C04B 2235/3275 (2013.01); C04B 2235/3826 (2013.01); C04B 2235/3891 (2013.01); C04B 2235/40 (2013.01); C04B 2235/402 (2013.01); C04B 2235/404 (2013.01); C04B 2235/405 (2013.01); C04B 2235/421 (2013.01); C04B 2235/427 (2013.01); C04B 2235/428 (2013.01); C04B 2235/80 (2013.01); C22C 2204/00 (2013.01);
Abstract

Thermally-stable polycrystalline diamond materials comprise a first phase including a plurality of bonded together diamond crystals, and a second phase including a reaction product formed between a binder/catalyst material and a material reactive with the binder/catalyst material. The reaction product is disposed within interstitial regions of the polycrystalline diamond material that exists between the bonded diamond crystals. The first and second phases are formed during a single high pressure/high temperature process condition. The reaction product has a coefficient of thermal expansion that is relatively closer to that of the bonded together diamond crystals than that of the binder/catalyst material.


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