Power module production method, and power module produced thereby

Abstract

There is provided a power module production method that is capable of stably producing a power module with highly reliable properties, and so forth. The power module production method produces a power moduleby stacking a cooler, an insulating resin sheet, a heat sink block, and a semiconductor chip, wherein a first insulating resin sheet, which forms a lower layer of the insulating resin sheet, is first bonded to the coolerby thermal compression. Next, with a second insulating resin sheet, which forms an upper layer of the insulating resin sheet, interposed between the first insulating resin sheetand the heat sink block, the second insulating resin sheetis bonded to the first insulating resin sheetby thermal compression, and the heat sink blockis bonded to the second insulating resin sheetby thermal compression. The semiconductor chipis then soldered onto the heat sink block. Thus, bonding defects at the respective bonding interfaces are prevented, and dielectric breakdown of the insulating resin sheetis prevented.