The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2014
Filed:
Feb. 25, 2013
Impinj, Inc., Seattle, WA (US);
Ronald Lee Koepp, Snoqualmie, WA (US);
Ronald A. Oliver, Seattle, WA (US);
Harley Heinrich, Snohomish, WA (US);
Jaideep Mavoori, Mercer Island, WA (US);
Tan Mau Wu, Seattle, WA (US);
Christopher J. Diorio, Shoreline, WA (US);
Impinj, Inc., Seattle, WA (US);
Abstract
An assembly having an RFID integrated circuit (IC), a nonconductive repassivation layer on a surface of the IC and confined within a perimeter of the surface, and a conductive redistribution layer on the repassivation layer and confined within the perimeter of the surface may be provided. At least a first portion of the redistribution layer may be electrically connected to the IC through a first opening in the repassivation layer. Furthermore, a substrate having a first antenna terminal may be provided, and a second opening may be formed in a nonconductive barrier present on at least one of the first antenna terminal and the first portion of the redistribution layer with an etchant. The first opening and the second opening may be nonoverlapping. The assembly may be attached to the substrate with an adhesive.