The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2014
Filed:
Sep. 28, 2011
Sjoerd Herder, Den Hoorn, NL;
Harro Koning, Arnhem, NL;
Sjoerd Herder, Den Hoorn, NL;
Harro Koning, Arnhem, NL;
ST-Ericsson SA, Plan-les-Ouates, CH;
Abstract
An integrated circuit chip is disclosed having a semiconductor substrate and a plurality of conduction layers (metalz, metalz+1), disposed on the semiconductor substrate and separated by dielectric layers, for distribution of power and electrical signals on the chip. The integrated circuit chip comprises a power-supply distribution network () which comprises, in a first one (metalz) of the conduction layers, a first mesh structure () of electrically conductive material for distribution of a first electrical potential (POWER) of the power supply. The power-supply distribution network also comprises, in a second one (metalz+1) of the conduction layers, different from the first one of the conduction layers, a second mesh structure () of electrically conductive material for distribution of a second electrical potential (GROUND) of the power supply. In the first one (metalz) of the conduction layers, a first plurality of islands () of electrically conductive material is provided, each island being located in a hole () of the first mesh structure () and being electrically insulated from the first mesh structure with a dielectric material.