The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2014

Filed:

Jan. 19, 2011
Applicants:

Robert J. Greenberg, Los Angeles, CA (US);

Neil Talbot, Montrose, CA (US);

Jerry OK, Canyon Country, CA (US);

Jordan Neysmith, Canyon Country, CA (US);

Dao Min Zhou, Saugus, CA (US);

Inventors:

Robert J. Greenberg, Los Angeles, CA (US);

Neil Talbot, Montrose, CA (US);

Jerry Ok, Canyon Country, CA (US);

Jordan Neysmith, Canyon Country, CA (US);

Dao Min Zhou, Saugus, CA (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/00 (2006.01); A61N 1/36 (2006.01); A61N 1/05 (2006.01); A61N 1/375 (2006.01); H01L 23/498 (2006.01); H05K 3/36 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01); H05K 3/32 (2006.01); H05K 3/42 (2006.01); H01L 21/56 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4691 (2013.01); A61N 1/36046 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/01077 (2013.01); A61N 1/0543 (2013.01); H05K 2201/1028 (2013.01); H05K 1/0306 (2013.01); H01L 2924/14 (2013.01); H05K 3/4652 (2013.01); H05K 2203/1446 (2013.01); A61N 1/375 (2013.01); H05K 2201/09127 (2013.01); H01L 2924/01019 (2013.01); H05K 3/321 (2013.01); H05K 3/423 (2013.01); H01L 2224/16225 (2013.01); H01L 23/4985 (2013.01); H01L 21/563 (2013.01); A61N 1/3758 (2013.01); H05K 3/328 (2013.01); H01L 2924/01046 (2013.01); H05K 2201/10977 (2013.01); H05K 2201/10295 (2013.01); H01L 2924/01078 (2013.01); H05K 3/361 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/01079 (2013.01); H05K 3/4015 (2013.01); H05K 2203/0733 (2013.01); H05K 2201/10287 (2013.01);
Abstract

The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.


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