The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2014
Filed:
Oct. 12, 2011
Applicants:
Nobuto Kageyama, Hamamatsu, JP;
Hirofumi Miyajima, Hamamatsu, JP;
Hirofumi Kan, Hamamatsu, JP;
Inventors:
Assignee:
Hamamatsu Photonics K.K., Hamamatsu-shi, Shizuoka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 3/04 (2006.01); H01S 5/024 (2006.01); H01S 5/40 (2006.01); H01S 5/022 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02423 (2013.01); H01S 5/4025 (2013.01); H01S 5/02264 (2013.01); H01S 5/02272 (2013.01); H01S 5/02236 (2013.01); H01S 5/02492 (2013.01);
Abstract
A semiconductor laser baris mounted onto a liquid-cooled heat sink. A molybdenum reinforcement memberis fixed onto the surface opposite to the surface on which the semiconductor laser moduleis mounted. The molybdenum has a linear expansion coefficient less than that of the heat sink. Sub-mounts are preferably made of a Cu—W alloy, more preferably of the reinforcement membermolybdenum. In this case, the stresses that are imposed on the heat sinkwhen being expanded or contracted can cancel each other out.