The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2014
Filed:
Nov. 11, 2011
Tomonaga Nishikawa, Tokyo, JP;
Makoto Yoshida, Tokyo, JP;
Tomokazu Ito, Tokyo, JP;
Hiroshi Kamiyama, Tokyo, JP;
Takeshi Okumura, Tokyo, JP;
Tsuneo Kuwahara, Tokyo, JP;
Tomonaga Nishikawa, Tokyo, JP;
Makoto Yoshida, Tokyo, JP;
Tomokazu Ito, Tokyo, JP;
Hiroshi Kamiyama, Tokyo, JP;
Takeshi Okumura, Tokyo, JP;
Tsuneo Kuwahara, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
An electronic component is provided with a substrate, a thin-film element layer provided on the substrate, first and second bump electrodes, provided on a surface of the thin-film element layer, and an insulator layer provided between the first bump electrode and the second bump electrode. The thin-film element layer contains a first spiral conductor which is a plane coil pattern. The first bump electrode is connected to an internal peripheral end of the first spiral conductor. The second bump electrode is connected to an external peripheral end of the first spiral conductor. Both of the first and second bump electrodes, have a first exposure surface exposed to a principal surface of the insulator layer and a second exposure surface exposed to an end face of the insulator layer.