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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8878371 B1

PDFFull Text
Expired
Date of Patent:
Nov. 04, 2014

Filed:

Apr. 17, 2013

Semiconductor device

Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventors:

Shoji Seta, Tokyo, JP;

Hideaki Ikuma, Kawasaki, JP;

Assignee:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Attorney:

Sprinkle IP Law Group

Primary Examiner:

Nitin Parekh

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/498 (2006.01); H01L 23/528 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/525 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); H01L 24/13 (2013.01); H01L 23/3192 (2013.01); H01L 24/05 (2013.01); H01L 2224/13006 (2013.01); H01L 2224/05572 (2013.01); H01L 2924/01077 (2013.01); H01L 2924/01005 (2013.01); H01L 23/3114 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/02373 (2013.01); H01L 24/04 (2013.01); H01L 23/525 (2013.01); H01L 2924/01006 (2013.01); H01L 2224/05548 (2013.01); H01L 23/5286 (2013.01); H01L 2224/02375 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01047 (2013.01); H01L 2224/0401 (2013.01); H01L 2924/01033 (2013.01);
Abstract

A semiconductor device has a semiconductor substrate which has a plurality of pad electrodes provided on a top surface thereof and has an approximately rectangular shape; a rewiring layer which is provided with a plurality of contact wiring lines connected to the plurality of pad electrodes, is disposed on the semiconductor substrate through an insulating film, and has an approximately rectangular shape; and a plurality of ball electrodes which are provided on the rewiring layer.

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Seta, Shoji. (2014). Semiconductor device (U.S. Patent No. 8878371). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8878371

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