The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2014
Filed:
Dec. 23, 2010
Applicants:
Thorsten Meyer, Regensburg, DE;
Josef Boeck, Munich, DE;
Rudolf Lachner, Ingolstadt, DE;
Herbert Schaefer, Hoehenkirchen-Siegertsbrunn, DE;
Inventors:
Thorsten Meyer, Regensburg, DE;
Josef Boeck, Munich, DE;
Rudolf Lachner, Ingolstadt, DE;
Herbert Schaefer, Hoehenkirchen-Siegertsbrunn, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01); H01L 23/525 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5258 (2013.01); H01L 2924/12044 (2013.01); H01L 22/14 (2013.01); H01L 2924/014 (2013.01); H01L 22/22 (2013.01);
Abstract
A method and a system for providing fusing after packaging of semiconductor devices are disclosed. In one embodiment, a semiconductor device is provided comprising a substrate comprising a fuse area, at least one fuse disposed in the fuse area, and at least one layer disposed over the substrate, wherein the at least one layer comprises at least one opening exposing the at least one fuse.