The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2014
Filed:
Sep. 09, 2013
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventors:
Guen-Ho Kim, Seoul, KR;
Yu Ho Won, Seoul, KR;
Assignee:
LG Innotek Co., Ltd., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/22 (2006.01); H01L 33/00 (2010.01); H01L 29/227 (2006.01); H01L 23/02 (2006.01); H01L 23/48 (2006.01); H01L 23/04 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 33/60 (2010.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/60 (2013.01); H01L 33/50 (2013.01); H01L 2924/0002 (2013.01); H01L 33/507 (2013.01); H01L 33/486 (2013.01);
Abstract
Disclosed is a light emitting device package. The light emitting device package includes a substrate including a recess, a light emitting chip on the substrate and a first conductive layer electrically connected to the light emitting chip. And the first conductive layer includes at least one metal layer electrically connected to the light emitting chip on an outer circumference of the substrate.