The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2014
Filed:
Jul. 25, 2012
Applicant:
Jae Sung You, Su won-si, KR;
Inventor:
Jae Sung You, Su won-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 21/76 (2006.01); H01L 21/00 (2006.01); H01L 33/48 (2010.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 33/54 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/005 (2013.01);
Abstract
A light emitting diode (LED) module includes a substrate, an LED disposed on the substrate, a phosphor layer disposed on the LED, and a lens disposed on the substrate. The substrate has a recess defined therein. The lens is fastened to the substrate through the recess. A manufacturing method for the LED includes forming the recess in the substrate, mounting the LED on the substrate, forming the phosphor layer on the LED, and forming the lens directly on the substrate such that the lens is fastened to the substrate through the recess.