The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2014
Filed:
Jan. 31, 2008
Applicants:
Donal Bradley, Beaconsfield, GB;
Lichun Chen, Linkoping, BE;
Patrick Dagenaar, London, GB;
Inventors:
Assignee:
Imperial Innovations Limited, London, GB;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/08 (2006.01); B82Y 10/00 (2011.01); G03F 7/00 (2006.01); B82Y 40/00 (2011.01); H01L 51/00 (2006.01); H01L 51/42 (2006.01);
U.S. Cl.
CPC ...
B82Y 10/00 (2013.01); H01L 51/0004 (2013.01); G03F 7/0002 (2013.01); Y02E 10/549 (2013.01); H01L 51/0013 (2013.01); B82Y 40/00 (2013.01); H01L 51/0026 (2013.01); H01L 51/424 (2013.01); H01L 51/4253 (2013.01);
Abstract
A method for depositing one or more organic layers onto a substrate, which includes: transferring the one or more layers from a depositing surface of a stamp to the substrate by bringing the layer coated depositing surface of the stamp into contact with the substrate, and the use of either or both of the steps of: (i) contacting the polymer with a plasticizer; and (ii) heating the substrate and/or stamp, in order to create favorable conditions for conformal contact and uniform layer transfer.