The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8878076 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 04, 2014

Filed:

Sep. 28, 2012
Applicant:

Fujitsu Limited, Kawasaki, JP;

Inventor:

Hideaki Yoshimura, Suzaka, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 3/42 (2006.01); H05K 3/44 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0353 (2013.01); H05K 1/0271 (2013.01); H05K 3/427 (2013.01); H05K 3/445 (2013.01); H05K 2201/068 (2013.01); H05K 2201/0323 (2013.01); H05K 2201/0959 (2013.01);
Abstract

A wiring substrate includes: a plate-like base material containing carbon fibers; a wiring layer formed on a surface of the base material; a first via including a first through hole penetrating through the base material, a first resin layer formed on an inner wall of the first through hole and including a second through hole, and a first conductive layer formed on an inner wall of the second through hole; and a second via including a third through hole penetrating through the base material and a second conductive layer formed on an inner wall of the third through hole, wherein an inside diameter of the third through hole is greater than an inside diameter of the second through hole.


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