The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2014

Filed:

Aug. 31, 2011
Applicants:

Emi Kashiwaya, Tokyo, JP;

Osamu Kindo, Tokyo, JP;

Noriou Shimada, Tokyo, JP;

Inventors:

Emi Kashiwaya, Tokyo, JP;

Osamu Kindo, Tokyo, JP;

Noriou Shimada, Tokyo, JP;

Assignee:

PS4 Luxco S.A.R.L., Luxembourg, LU;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01); H05K 3/40 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 3/284 (2013.01); H01L 24/48 (2013.01); H05K 2203/1316 (2013.01); H01L 2924/01005 (2013.01); H05K 1/0271 (2013.01); H01L 2224/48227 (2013.01); H05K 3/4015 (2013.01); H01L 23/3142 (2013.01); H01L 2924/014 (2013.01); H01L 21/561 (2013.01); H01L 2924/01079 (2013.01); H01L 2203/041 (2013.01); H05K 3/0097 (2013.01); H01L 21/565 (2013.01); H01L 2224/97 (2013.01); H01L 2924/01029 (2013.01); H01L 24/97 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01006 (2013.01); H01L 23/49838 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/48091 (2013.01);
Abstract

A wiring board of this invention includes a product formation area in which are arranged a plurality of product formation sections on which a semiconductor chip is mounted; a molding area that is provided on an outer circumferential side of the product formation area, and with which a seal portion that covers the semiconductor chips mounted on the product formation sections makes contact; a clamp area that is provided on an outer circumferential side of the molding area, and that is held by a molding die that forms the seal portion; wiring that is provided in the product formation area, and that is electrically connected to the semiconductor chips; a first solid pattern that is provided in the molding area, and in which a plurality of dots are arranged; and a second solid pattern that is provided in the clamp area, and in which a plurality of dots that are larger than the dots of the first solid pattern are arranged.


Find Patent Forward Citations

Loading…