The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2014

Filed:

Feb. 06, 2009
Applicants:

Stephane Bizet, Serquigny, FR;

Anthony Bonnet, Beaumont le Roger, FR;

Nicolas Devaux, Lyons, FR;

Johann Laffargue, Plasnes, FR;

Aude Lapprand, Paris, FR;

Inventors:

Stephane Bizet, Serquigny, FR;

Anthony Bonnet, Beaumont le Roger, FR;

Nicolas Devaux, Lyons, FR;

Johann Laffargue, Plasnes, FR;

Aude Lapprand, Paris, FR;

Assignee:

Arkema France, Colombes, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/00 (2006.01); B32B 27/28 (2006.01); B32B 27/08 (2006.01); B32B 27/30 (2006.01); C08L 27/16 (2006.01); C08L 33/12 (2006.01); H01L 31/048 (2014.01);
U.S. Cl.
CPC ...
B32B 27/28 (2013.01); B32B 27/08 (2013.01); B32B 27/30 (2013.01); C08L 27/16 (2013.01); C08L 33/12 (2013.01); H01L 31/048 (2013.01); Y02E 10/50 (2013.01);
Abstract

The invention relates to a multilayer film of A/B/C structure comprising: a first layer of composition A, comprising a fluoropolymer; a second layer of composition B, comprising a filled fluoropolymer; and a third layer of composition C, comprising a fluoropolymer, characterized in that the first and third layers have a melting point above 150° C., measured by DSC, and in that the transmittance in visible light is less than 30% for a multilayer film thickness of 25 μm. The invention also relates to the use of a fluoropolymer-based film preferably for a photovoltaic cell back panel, a high-performance textile or a metal, the film adhering to the substrate by means of an adhesive layer placed between the substrate and the film.


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