The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2014
Filed:
Sep. 06, 2012
Applicant:
Arvind Chandrasekaran, San Diego, CA (US);
Inventor:
Arvind Chandrasekaran, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/50 (2006.01); H01L 23/367 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 21/50 (2013.01); H01L 23/481 (2013.01); H01L 2225/06589 (2013.01); H01L 2224/16145 (2013.01); H01L 2225/06541 (2013.01); H01L 23/367 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/16225 (2013.01); H01L 2225/06513 (2013.01); H01L 23/3672 (2013.01); H01L 2225/06517 (2013.01); H01L 2924/10253 (2013.01); H01L 2225/06568 (2013.01);
Abstract
An electrical package with improved thermal management. The electrical package includes a die having an exposed back surface. The package further includes a plurality of fins extending outwardly from the back surface for dissipating heat from the package. The die can be arranged in a multi-die stacking configuration. In another embodiment, a method of forming a die for improved thermal management of an electrical package is provided.
Chandrasekaran, Arvind. (2014). Microfabricated pillar fins for thermal management (U.S. Patent No. 8877563). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8877563
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile