The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2014
Filed:
Aug. 05, 2010
Applicant:
Keiichiro Utsunomiya, Tokyo, JP;
Inventor:
Keiichiro Utsunomiya, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Chiyoda-Ku, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 31/18 (2006.01); H01L 31/048 (2014.01); B32B 17/10 (2006.01);
U.S. Cl.
CPC ...
H01L 31/18 (2013.01); B32B 2327/12 (2013.01); H01L 31/0487 (2013.01); B32B 2367/00 (2013.01); B32B 17/10871 (2013.01); B32B 17/10788 (2013.01); B32B 17/10798 (2013.01); B32B 17/10761 (2013.01); Y02E 10/50 (2013.01); H01L 31/048 (2013.01); B32B 17/10018 (2013.01);
Abstract
A solar cell module includes a structure in which a back surface material, a back-surface-side sealing resin, a solar cell, a light-receiving-surface-side sealing resin, and a front surface material are laminated in sequential order, in which a melting point of a portion, which is in contact with the solar cell, of at least one of the light-receiving-surface-side sealing resin and the back-surface-side sealing resin is lower than a melting point of a portion, which is in contact with the back surface material, of the back-surface-side sealing resin.