The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2014

Filed:

Apr. 30, 2008
Applicants:

Mark Bachman, Irvine, CA (US);

Guann-pyng LI, Irvine, CA (US);

Inventors:

Mark Bachman, Irvine, CA (US);

Guann-Pyng Li, Irvine, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/02 (2006.01); H01B 13/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00182 (2013.01); B81B 2203/0118 (2013.01); B81C 1/00253 (2013.01); B81B 2203/0109 (2013.01);
Abstract

Systems and methods for producing micromachined devices, including sensors, actuators, optics, fluidics, and mechanical assemblies, using manufacturing techniques of lead frames, substrates, microelectronic packages, printed circuit boards, flex circuits, and rigid-flex materials. Preferred embodiments comprise using methods from post-semiconductor manufacturing to produce three-dimensional and free-standing structures in non-semiconductor materials. The resulting devices may remain part of the substrate, board or lead frame which can then used as a substrate for further packaging electronic assembly operations. Alternatively, the devices may be used as final components that can be assembled within other devices.


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