The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2014

Filed:

Jun. 08, 2011
Applicants:

Jong Hyun Park, Seoul, KR;

Chang Dong Kim, Seoul, KR;

Gee Sung Chae, Incheon, KR;

Juhn Suk Yoo, Goyang-si, KR;

Soo Young Yoon, Goyang-si, KR;

Soon Wook Cha, Goyang-si, KR;

Won Bong Jang, Seoul, KR;

Jae Kyung Choi, Bucheon-si, KR;

Inventors:

Jong Hyun Park, Seoul, KR;

Chang Dong Kim, Seoul, KR;

Gee Sung Chae, Incheon, KR;

Juhn Suk Yoo, Goyang-si, KR;

Soo Young Yoon, Goyang-si, KR;

Soon Wook Cha, Goyang-si, KR;

Won Bong Jang, Seoul, KR;

Jae Kyung Choi, Bucheon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01); B32B 37/00 (2006.01); B32B 38/10 (2006.01); B32B 38/04 (2006.01); B32B 27/00 (2006.01); B29C 63/00 (2006.01); C09J 5/00 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0097 (2013.01); C09J 5/00 (2013.01); C09J 2203/326 (2013.01); C09J 2205/302 (2013.01); C09J 2205/31 (2013.01); Y02E 10/549 (2013.01); H01L 51/003 (2013.01); H01L 2251/5338 (2013.01);
Abstract

Disclosed is a method for manufacturing a flexible device comprising: forming an adhesive layer on a support substrate; adhering a flexible substrate onto the adhesive layer; forming a device layer on the flexible substrate; and separating the support substrate from the flexible substrate, wherein the adhesive layer comprises a self-assembled monolayer (SAM).


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