The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2014

Filed:

Oct. 11, 2012
Applicant:

Toppan Printing Co., Ltd., Tokyo, JP;

Inventors:

Hiroshi Sugimura, Tokyo, JP;

Gaku Suzuki, Tokyo, JP;

Masahiro Ueno, Tokyo, JP;

Yoshihiro Kodama, Tokyo, JP;

Takao Tomono, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 1/00 (2006.01); B24B 19/16 (2006.01); B29C 33/42 (2006.01); B29C 33/38 (2006.01); A61M 37/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 33/424 (2013.01); B29L 2031/756 (2013.01); B29L 2031/7544 (2013.01); B24B 19/16 (2013.01); B29C 33/3842 (2013.01); A61M 37/0015 (2013.01); B29C 33/3878 (2013.01); A61M 2037/0053 (2013.01);
Abstract

A method of manufacturing a microneedle including forming a plurality of first linear grooves on a substrate in parallel to one another along a first direction using grinding and forming a plurality of second linear grooves on the substrate in parallel to one another in a second direction intersecting the first direction using grinding. At least one of the forming of a plurality of first linear grooves and the forming of a plurality of second linear grooves includes forming first stage grooves using a first dicing blade; and processing the first stage grooves by tracing the first stage grooves using a second dicing blade having a side surface different from that of the first dicing blade to thereby form second stage grooves.


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