The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2014

Filed:

Nov. 09, 2012
Applicant:

Honda Tsushin Kogyo Co., Ltd., Tokyo, JP;

Inventors:

Teruyuki Taniguchi, Tokyo, JP;

Yuushi Miki, Tokyo, JP;

Koichiro Yoshimura, Tokyo, JP;

Shigehiro Oi, Tokyo, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/36 (2006.01); G02B 6/42 (2006.01); H05K 3/30 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
G02B 6/42 (2013.01); H05K 2201/09181 (2013.01); H05K 2201/049 (2013.01); H05K 1/18 (2013.01); G02B 6/4204 (2013.01); H05K 3/30 (2013.01); H05K 2201/10121 (2013.01); G02B 6/428 (2013.01); H05K 2201/1034 (2013.01); G02B 6/422 (2013.01); H05K 1/141 (2013.01);
Abstract

An optical device boardis set to be a printed circuit board in which an optical deviceis bonded into a predetermined position of a printed wiring board. The optical device boardis bonded to a base boardprovided with a plurality of wiring terminals. A lens barrelis bonded to the optical device board. The optical deviceis bonded into a position calculated from an actual measured dimension of the printed wiring board, and the calculated position is held and positioning is carried out in such a manner that a central axis of the lens barrelis coincident with the calculated position when the lens barrelis to be bonded to the optical device board


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