The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2014
Filed:
Mar. 27, 2012
Hirofumi Kondo, Tajimi, JP;
Yasuhiro Kato, Nagoya, JP;
Masayoshi Hayashi, Nagoya, JP;
Tatsuya Nishikawa, Nagoya, JP;
Reiko Higashikawa, Iwakura, JP;
Toru Yamashita, Nagoya, JP;
Masato Sueyasu, Nagoya, JP;
Hirofumi Kondo, Tajimi, JP;
Yasuhiro Kato, Nagoya, JP;
Masayoshi Hayashi, Nagoya, JP;
Tatsuya Nishikawa, Nagoya, JP;
Reiko Higashikawa, Iwakura, JP;
Toru Yamashita, Nagoya, JP;
Masato Sueyasu, Nagoya, JP;
Brother Kogyo Kabushiki Kaisha, Nagoya-Shi, Aichi-Ken, JP;
Abstract
A liquid jetting apparatus includes: a liquid jetting head in which nozzles for jetting the liquid are formed and which has an actuator for jetting the liquid from the nozzles; an interposer substrate which is provided to the liquid jetting head and on which a driver IC is mounted; a control substrate which controls the liquid jetting head; a wire member which connects the interposer substrate and the control substrate; and a flexible circuit board which connects the interposer substrate and the actuator, wherein the interposer substrate has a first connecting portion to which the wire member is to be connected, and a second connecting portion to which the flexible circuit board is to be connected, and the driver IC is arranged nearer to the first connecting portion than the second connecting portion of the interposer substrate.