The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2014
Filed:
Jul. 12, 2011
Applicant:
Koji Hosokawa, Tokyo, JP;
Inventor:
Koji Hosokawa, Tokyo, JP;
Assignee:
PS4 Luxco S.A.R.L., Luxembourg, LU;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H05K 3/28 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/565 (2013.01); H01L 2224/73265 (2013.01); H01L 24/48 (2013.01); H01L 2224/97 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/01029 (2013.01); H05K 3/284 (2013.01); H01L 2924/014 (2013.01); H01L 2224/48091 (2013.01); H05K 3/0097 (2013.01); H01L 24/97 (2013.01); H01L 21/561 (2013.01); H01L 23/3128 (2013.01); H01L 2924/01033 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/15311 (2013.01); H05K 3/0052 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01079 (2013.01); H05K 2203/1327 (2013.01); H01L 2224/48228 (2013.01); H01L 2924/01006 (2013.01);
Abstract
A device includes a wiring board, an element mounted on the wiring board, a spacer member intervening between the wiring board and the element to form a space therebetween, and an encapsulation body filling the space and encapsulating the element on the wiring board.