The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2014
Filed:
Jan. 08, 2014
Applicant:
Taiyo Yuden Co., Ltd., Tokyo, JP;
Inventors:
Hiroshi Nakamura, Tokyo, JP;
Tomohiro Igarashi, Tokyo, JP;
Assignee:
Taiyo Yuden Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 7/46 (2006.01); H03H 9/70 (2006.01); H05K 7/20 (2006.01); H04B 1/50 (2006.01); H03H 9/08 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H03H 9/05 (2006.01); H04L 5/14 (2006.01); H04B 1/44 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H04L 5/14 (2013.01); H03H 9/08 (2013.01); H05K 1/0216 (2013.01); H05K 1/185 (2013.01); H03H 9/0566 (2013.01); H03H 7/463 (2013.01); H05K 1/0237 (2013.01); H05K 1/0206 (2013.01); H05K 1/0207 (2013.01); H04B 1/44 (2013.01); H01L 23/3735 (2013.01);
Abstract
The high frequency circuit module includes an RFIC configured to transmit and receive a high frequency signal, a power amplifier IC configured to amplify a transmission signal outputted from the RFIC, and a duplexers configured to separate the transmission signal outputted from the power amplifier IC and inputted to an antenna and a reception signal from the antenna and inputted to the RFIC from each other, in which at least one of the RFIC and power amplifier IC is embedded in the circuit substrate, and the duplexers are disposed between the RFIC and the power amplifier IC.