The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 28, 2014

Filed:

Jun. 24, 2010
Applicants:

Bart Van Velzen, Arnhem, NL;

Hans Van Zadelhoff, Andelst, NL;

Greja Johanna Adriana Maria Verheijden, Riethoven, NL;

Inventors:
Assignee:

NXP, B.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 21/14 (2006.01); H01L 21/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00333 (2013.01); B81C 2203/0136 (2013.01);
Abstract

A method of manufacturing a MEMS device comprises forming a MEMS device element (). A sidewall () is formed around the MEMS device element, and a sacrificial layer () is formed over the device element and within the sidewall. A package cover layer () is provided over the sacrificial layer, and the sacrificial layer is removed. This method provides additional sidewalls to the cap provided over the MEMS device. These additional sidewalls can then be deposited by a different process and be formed of a different material to the top part of the package cover layer. The sidewalls can prevent reflow of the sacrificial layer and improve the sealing properties of the sidewalls.


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