The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2014
Filed:
Nov. 07, 2012
Applicant:
DO Hyun Park, Uiwang-si, KR;
Inventor:
Do Hyun Park, Uiwang-si, KR;
Assignee:
Cheil Industries, Inc., Gumi-si, Kyeongsangbuk-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 1/12 (2006.01); C08G 18/06 (2006.01); H01L 23/28 (2006.01); C09J 175/16 (2006.01); H01L 23/00 (2006.01); C09J 9/02 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); C09J 175/16 (2013.01); C09J 9/02 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/32225 (2013.01); H01L 24/32 (2013.01); H01L 2224/2929 (2013.01); H01L 2924/07811 (2013.01);
Abstract
An anisotropic conductive film composition for bonding a semiconductor device, the composition including: a binder system including a urethane resin having a glass transition temperature of about 100° C. or higher, a radical polymerizable compound, an organic peroxide, and conductive particles.