The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 28, 2014

Filed:

Dec. 05, 2011
Applicants:

Noel a Lopez, Chandler, AZ (US);

Michael R Lyons, Gilbert, AZ (US);

Dave Laidig, Mesa, AZ (US);

Kenneth V Buer, Gilbert, AZ (US);

Inventors:

Noel A Lopez, Chandler, AZ (US);

Michael R Lyons, Gilbert, AZ (US);

Dave Laidig, Mesa, AZ (US);

Kenneth V Buer, Gilbert, AZ (US);

Assignee:

ViaSat, Inc., Carlsbad, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H05K 1/02 (2006.01); H01L 23/13 (2006.01); H01L 23/66 (2006.01); H05K 3/00 (2006.01); H01L 23/00 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/13 (2013.01); H01L 2924/19039 (2013.01); H01L 2924/19105 (2013.01); H05K 3/0061 (2013.01); H01L 24/49 (2013.01); H01L 2924/01029 (2013.01); H05K 1/0203 (2013.01); H01L 2924/01013 (2013.01); H01L 24/97 (2013.01); H05K 2201/09845 (2013.01); H01L 2924/01079 (2013.01); H01L 2224/97 (2013.01); H01L 2924/14 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48227 (2013.01); H01L 23/4006 (2013.01); H01L 2224/49175 (2013.01); H01L 2223/6633 (2013.01); H01L 2924/014 (2013.01); H01L 2924/1423 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01074 (2013.01); H01L 23/66 (2013.01); H05K 2201/10189 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/0103 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/2919 (2013.01); H01L 2223/6683 (2013.01); H01L 2924/1517 (2013.01); H01L 24/29 (2013.01); H01L 2924/01078 (2013.01); H01L 24/32 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/1616 (2013.01); H01L 2224/49171 (2013.01); H01L 24/48 (2013.01); H01L 2924/30107 (2013.01); H05K 1/0243 (2013.01); H01L 2924/19043 (2013.01);
Abstract

A millimeter wave integrated waveguide interface package device may comprise: (1) a package comprising a printed wiring board (PWB) and a monolithic microwave integrate circuit (MMIC), wherein the MMIC is in communication with the PWB; and (2) a waveguide interface integrated with the package. The package may be adapted to operate at high frequency and high power, where high frequency includes frequencies greater than about 5 GHz, and high power includes power greater than about 0.5 W.


Find Patent Forward Citations

Quick Actions:

Lopez, Noel. (2014). System and method for integrated waveguide packaging (U.S. Patent No. 8872333). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8872333

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…