The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2014
Filed:
Apr. 25, 2011
Applicant:
Young-seok Hong, Suwon-si, KR;
Inventor:
Young-Seok Hong, Suwon-si, KR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/03 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 24/49 (2013.01); H01L 23/3135 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19107 (2013.01); H01L 24/48 (2013.01); H01L 2924/15321 (2013.01); H01L 2224/45144 (2013.01); H01L 24/45 (2013.01); H01L 2924/014 (2013.01); H01L 2224/32145 (2013.01); H01L 25/03 (2013.01); H01L 24/16 (2013.01); H01L 2224/45124 (2013.01); H01L 2225/06517 (2013.01); H01L 2224/48228 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/06565 (2013.01); H01L 2924/078 (2013.01); H01L 2224/49175 (2013.01); H01L 23/3128 (2013.01); H01L 2225/0651 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/01079 (2013.01); H01L 25/0657 (2013.01); H01L 2924/01013 (2013.01); H01L 2224/4911 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/15331 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/01033 (2013.01);
Abstract
A stacked package for an electronic device and a method of manufacturing the stacked package include a first semiconductor package being formed with a first conductive pad and a second conductive pad. A second semiconductor package is formed with a third conductive pad and a fourth conductive pad and is disposed over the first semiconductor package. A first conductive connecting member electrically connects the first conductive pad and the third conductive pad. A second conductive connection member electrically connects the second conductive pad and the fourth conductive pad.