The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2014
Filed:
May. 26, 2009
Takayuki Ushio, Chiyoda-ku, JP;
Yoshihisa Oguri, Chiyoda-ku, JP;
Akira Goto, Chiyoda-ku, JP;
Jyunya Kanazawa, Shibuya-ku, JP;
Takayuki Ushio, Chiyoda-ku, JP;
Yoshihisa Oguri, Chiyoda-ku, JP;
Akira Goto, Chiyoda-ku, JP;
Jyunya Kanazawa, Shibuya-ku, JP;
Mitsubishi Electric Corporation, Chiyoda-Ku, Tokyo, JP;
Abstract
A package apparatus is for packaging a power semiconductor device that includes a substrate formed, a mold part molded on the substrate, and electrode terminals extended from the mold part to a side opposite from the substrate by a predetermined length; includes: a holding unit that has insertion slots and is to holding the power semiconductor device, the insertion slots each being an opening into which the power semiconductor device is insertable in a direction perpendicular to extending direction of the electrode, edges of the opening being formed to make contact with the mold part and the substrate; and a container box that contains the holding unit. The insertion slots are provided to the holding unit so that an interval between the insertion slots in an extending direction of the electrode terminals of the power semiconductor device inserted is greater than the extending length of the electrode terminals.