The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 28, 2014

Filed:

Mar. 02, 2012
Applicants:

James Geza Deak, Zhangjiagang, CN;

Insik Jin, Zhangjiagang, CN;

Weifeng Shen, Zhangjiagang, CN;

Songsheng Xue, Zhangjiagang, CN;

Xiaofeng Lei, Zhangjiagang, CN;

Xiaojun Zhang, Zhangjiagang, CN;

Dongfeng LI, Zhangjiagang, CN;

Inventors:

James Geza Deak, Zhangjiagang, CN;

Insik Jin, Zhangjiagang, CN;

Weifeng Shen, Zhangjiagang, CN;

Songsheng Xue, Zhangjiagang, CN;

Xiaofeng Lei, Zhangjiagang, CN;

Xiaojun Zhang, Zhangjiagang, CN;

Dongfeng Li, Zhangjiagang, CN;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/22 (2006.01); H01L 25/04 (2014.01); G01R 33/09 (2006.01); H01L 43/02 (2006.01);
U.S. Cl.
CPC ...
H01L 25/04 (2013.01); G01R 33/093 (2013.01); H01L 43/02 (2013.01); G01R 33/098 (2013.01);
Abstract

A multi-chip push-pull magnetoresistive bridge sensor utilizing magnetic tunnel junctions is disclosed. The magnetoresistive bridge sensor is composed of a two or more magnetic tunnel junction sensor chips placed in a semiconductor package. For each sensing axis parallel to the surface of the semiconductor package, the sensor chips are aligned with their reference directions in opposition to each other. The sensor chips are then interconnected as a push-pull half-bridge or Wheatstone bridge using wire bonding. The chips are wire-bonded to any of various standard semiconductor lead frames and packaged in inexpensive standard semiconductor packages.


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