The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2014
Filed:
Oct. 14, 2010
Applicants:
Tetsu Negishi, Osaka, JP;
Akihide Shibata, Osaka, JP;
Satoshi Morishita, Osaka, JP;
Kenji Komiya, Osaka, JP;
Hiroshi Iwata, Osaka, JP;
Akira Takahashi, Osaka, JP;
Inventors:
Tetsu Negishi, Osaka, JP;
Akihide Shibata, Osaka, JP;
Satoshi Morishita, Osaka, JP;
Kenji Komiya, Osaka, JP;
Hiroshi Iwata, Osaka, JP;
Akira Takahashi, Osaka, JP;
Assignee:
Sharp Kabushiki Kaisha, Osaka-shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/20 (2010.01); H01L 33/38 (2010.01); H01L 33/62 (2010.01); H01L 33/32 (2010.01);
U.S. Cl.
CPC ...
H01L 33/20 (2013.01); H01L 33/38 (2013.01); H01L 33/62 (2013.01); H01L 2224/48463 (2013.01); H01L 33/007 (2013.01); H01L 33/32 (2013.01);
Abstract
To facilitate electrode connections and achieve a high light emitting efficiency, a rod-like light-emitting device includes a semiconductor core of a first conductivity type having a rod shape, and a semiconductor layer of a second conductivity type formed to cover the semiconductor core. The outer peripheral surface of part of the semiconductor core is exposed.