The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8872190 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 28, 2014

Filed:

Oct. 04, 2012
Applicant:

M/a-com Technology Solutions Holdings, Inc., Lowell, MA (US);

Inventors:

Alan C. Young, Corlette, AU;

Simon J. Mahon, Avalon, AU;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0312 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device including a plurality of source pads, a plurality of drain fingers, a plurality of gate fingers, a drain combiner connected to the plurality of drain fingers, and a gate combiner connected to the plurality of gate fingers. The plurality of source pads generally comprises a pair of end source pads and one or more inner source pads. Each end source pad is configured to have added inductance. Each of the drain fingers is generally disposed between two of the plurality of source pads. Each of the gate fingers is generally disposed between a respective source pad and a respective drain finger.


Find Patent Forward Citations

Young, Alan. (2014). Multi-finger hemt layout providing improved third order intercept point and saturated output power performance (U.S. Patent No. 8872190). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8872190

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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