The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2014
Filed:
Jun. 22, 2012
Applicants:
Tsuyoshi Kanki, Atsugi, JP;
Shoichi Suda, Machida, JP;
Yoshihiro Nakata, Atsugi, JP;
Inventors:
Assignee:
Fujitsu Limited, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 23/49816 (2013.01); H01L 2224/12105 (2013.01); H01L 2924/01029 (2013.01);
Abstract
A wiring structure includes: an insulating film formed over a substrate; a plurality of wirings formed on the insulating film; and an inducing layer, which is formed on the insulating film in a region between the plurality of wirings, a constituent atoms of the wirings are diffused in the inducing layer.
Kanki, Tsuyoshi. (2014). Wiring structure and manufacturing method thereof, and electronic apparatus and manufacturing method thereof (U.S. Patent No. 8872040). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8872040
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile