The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2014
Filed:
Dec. 06, 2012
Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd., Shenzhen, CN;
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Shin-Wen Chen, New Taipei, TW;
Shu-Sheng Peng, Shenzhen, CN;
Wen-Chang Chen, New Taipei, TW;
Wen-Hsiung Chen, New Taipei, TW;
Li-Min Liu, Shenzhen, CN;
Yu-Tsan Cheng, New Taipei, TW;
Yong Li, Shenzhen, CN;
Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Shenzhen, CN;
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Abstract
A circuit board assembly includes a flexible circuit board and a reinforcing plate. The flexible circuit board includes a surface. A conductive layer is positioned on the surface. The conductive layer includes a circuit portion entirely covered by a dielectric layer and a grounding portion exposed outside the dielectric layer. The reinforcing plate is mounted on the dielectric layer. The reinforcing plate includes a connection surface connected to the dielectric layer and a supporting surface facing away from the connection surface. Projections extend from the connection surface. The location of all of the projections correspond to the location of the grounding portion, and all of the projections are in electrical contact with the grounding portion by means of a conductive adhesive.