The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 28, 2014

Filed:

Jul. 08, 2010
Applicants:

Andreas Pawlik, Recklinghausen, DE;

Martin Roos, Haltern am See, DE;

Franz-erich Baumann, Duelmen, DE;

Harald Haeger, Luedinghausen, DE;

Inventors:

Andreas Pawlik, Recklinghausen, DE;

Martin Roos, Haltern am See, DE;

Franz-Erich Baumann, Duelmen, DE;

Harald Haeger, Luedinghausen, DE;

Assignee:

Evonik Degussa GmbH, Essen, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L 77/00 (2006.01); C08G 69/26 (2006.01); C08L 77/06 (2006.01);
U.S. Cl.
CPC ...
C08G 69/265 (2013.01); C08L 77/06 (2013.01);
Abstract

A molding compound, containing at least 30% by weight of a copolyamide, which is derived from the following monomers: a) 50 to 95 mole percent of the combination of a diamine, selected from the group consisting of 1,9-nonane diamine, 1,10-decane diamine, 1,11-undecane diamine and 1,12-dodecane diamine, and terephthalic acid, and b) 5 to 50 mole percent of the combination of a diamine, selected from the group consisting of 2,2,4-trimethylhexamethylene diamine, 2,4,4-trimethylhexamethylene diamine, and mixtures thereof, and terephthalic acid. The copolyamide is crystalline and has low water absorption.


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