The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 28, 2014

Filed:

Feb. 08, 2011
Applicants:

Hiroomi Eguchi, Seto, JP;

Takashi Okawa, Toyota, JP;

Atsushi Onogi, Toyota, JP;

Inventors:

Hiroomi Eguchi, Seto, JP;

Takashi Okawa, Toyota, JP;

Atsushi Onogi, Toyota, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 29/66 (2006.01); H01L 29/423 (2006.01); H01L 29/739 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
H01L 29/6625 (2013.01); H01L 29/66325 (2013.01); H01L 29/4236 (2013.01); H01L 29/7394 (2013.01); H01L 21/30604 (2013.01);
Abstract

A manufacturing method for manufacturing a lateral semiconductor device having an SOI (Silicon on Insulator) substrate, the lateral semiconductor device comprising a semiconductor layer that includes a buried oxide layer and a drift region, the manufacturing method comprising an etching process of etching, by a predetermined depth, a LOCOS oxide that projects from a surface of the semiconductor layer by a predetermined thickness and is embedded in the semiconductor layer by a predetermined thickness, and a trench forming process of simultaneously forming a first trench extending from the drift region toward the buried oxide layer, and a second trench extending from a portion obtained by the etching in the etching process toward the buried oxide layer, at a same etching rate, and stopping forming the first trench and the second trench at a time when the second trench reaches the buried oxide layer.


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