The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2014
Filed:
Oct. 10, 2011
Laine Mears, Anderson, SC (US);
Thomas Martens, Greenville, SC (US);
Laine Mears, Anderson, SC (US);
Thomas Martens, Greenville, SC (US);
Clemson University, Clemson, SC (US);
Abstract
Composites that include a metal injection molded component bonded to a support substrate and methods for forming the composites are described. Methods include forming a metal injection molded green part that includes microstructures on a surface of the green part. The metal injection molded component is located adjacent to a support substrate with the microstructure ends contacting the support substrate at a contact surface. During sintering the metal injection molded component is bonded to the support substrate at the ends of the microstructures. The presence of the microstructures can allow for relative motion between the metal injection molded component and the support substrate during sintering. The large bonding surface area provided by the multiple points of contact between the ends of the microstructures and the support substrate can provide excellent bonding force between the metal injection molded component and the support substrate.