The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 28, 2014

Filed:

Feb. 27, 2009
Applicants:

Tsung-yen Tsai, Pingjhen, TW;

Shau-tai LU, Guan Si Township, TW;

Chia-hsiang Liu, Phinjhen, TW;

Chun-chieh Huang, Sinjhuang, TW;

Hsien-chung Tsai, Hsinchu, TW;

Jen-chun Lin, Hsinchu, TW;

Inventors:

Tsung-Yen Tsai, Pingjhen, TW;

Shau-Tai Lu, Guan Si Township, TW;

Chia-Hsiang Liu, Phinjhen, TW;

Chun-Chieh Huang, Sinjhuang, TW;

Hsien-Chung Tsai, Hsinchu, TW;

Jen-Chun Lin, Hsinchu, TW;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09K 21/14 (2006.01); C01B 33/44 (2006.01); C08B 9/02 (2006.01); C08K 3/36 (2006.01); C08K 3/04 (2006.01); C08L 63/00 (2006.01);
U.S. Cl.
CPC ...
C09K 21/41 (2013.01); C08K 2003/045 (2013.01); C01B 33/44 (2013.01); C08L 63/00 (2013.01); C08B 9/02 (2013.01); C08K 3/36 (2013.01); Y10S 428/921 (2013.01);
Abstract

A modified clay is provided, which includes a layered clay material intercalated with a modifier having a conjugated double bond and capable of producing free radicals when heated. A clay-polymer composite is also provided, which includes a polymer material and the modified clay, wherein the modified clay is dispersed in the polymer material and at least partially exfoliated. The modifier is capable of producing free radicals when heated to scavenge free radicals generated from thermal cracking or burning of the polymer material to prevent further thermal cracking of the polymer material.


Find Patent Forward Citations

Loading…