The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 28, 2014

Filed:

Aug. 20, 2013
Applicant:

The Board of Trustees of the University of Illinois, Urbana, IL (US);

Inventors:

J. Gary Eden, Champaign, IL (US);

Sung-Jin Park, Champaign, IL (US);

JeKwon Yoon, Gyeonggi-do, KR;

Brian Chung, Bloomingdale, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 9/02 (2006.01); H05H 1/24 (2006.01); C02F 1/461 (2006.01); C01B 13/10 (2006.01); H01T 21/00 (2006.01); C02F 1/48 (2006.01); C02F 1/46 (2006.01); C02F 1/32 (2006.01); B01D 53/32 (2006.01); C02F 1/78 (2006.01);
U.S. Cl.
CPC ...
H01T 21/00 (2013.01); B01D 2259/818 (2013.01); H05H 1/2406 (2013.01); C02F 1/32 (2013.01); H05H 2001/2418 (2013.01); B01D 53/32 (2013.01); H05H 2245/121 (2013.01); C02F 2303/04 (2013.01); C02F 1/46109 (2013.01); C02F 1/78 (2013.01); B01D 2257/91 (2013.01); C01B 13/10 (2013.01); B01D 2257/104 (2013.01); C02F 2001/46152 (2013.01); C02F 1/48 (2013.01); B01D 2258/06 (2013.01); C02F 1/4608 (2013.01); C02F 2001/46133 (2013.01);
Abstract

Methods of the invention can form microtip microplasma devices having the first and second metal microtips and metal oxide in a monolithic, unitary structure. Methods can form arrays that can be flexible, can be arranged in stacks, and can be formed into cylinders, for example, for gas and liquid processing devices, air filters and other applications. A preferred method of forming an array of microtip microplasma devices provides a metal mesh with an array of micro openings therein. Electrode areas of the metal mesh are masked leaving planned connecting metal oxide areas of the metal mesh unmasked. Planned connecting metal oxide areas are electrochemically etched to convert the planned connecting metal oxide areas to metal oxide that encapsulates opposing metal microtips therein. The mask is removed. The electrode areas are electrochemically etched to encapsulate the electrode areas in metal oxide.


Find Patent Forward Citations

Loading…