The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2014
Filed:
Dec. 04, 2009
David Deutsch, Cranberry Township, PA (US);
Bruce Thompson, Pittsburgh, PA (US);
David Monto, McKees Rocks, PA (US);
Robert Jaynes, Pittsburgh, PA (US);
William Meyer, Wexford, PA (US);
Shawn T. Greyshock, Tarentum, PA (US);
David Deutsch, Cranberry Township, PA (US);
Bruce Thompson, Pittsburgh, PA (US);
David Monto, McKees Rocks, PA (US);
Robert Jaynes, Pittsburgh, PA (US);
William Meyer, Wexford, PA (US);
Shawn T. Greyshock, Tarentum, PA (US);
Aesynt Incorporated, Cranberry, PA (US);
Abstract
An apparatus for singulating unit dose blisters from a blister card including at least two perforations separating unit dose blisters positioned adjacent to each other and extending along a longitudinal length of the blister card is provided. The apparatus may include a perforation determiner and a blister card cutter. The perforation determiner may be configured to generate information indicative of a distance between a first perforation location and a second perforation location of the blister card with respect to perforations extending along a direction substantially perpendicular to the longitudinal length of the blister card and separating unit dose blisters to be singulated. The blister card cutter may be configured to utilize the received information indicative of the distance and the total number of perforations to determine cutting locations for cutting at the first perforation location, the second perforation location and additional perforation locations and enable cutting of each perforation extending substantially perpendicular to the longitudinal length of the blister card responsive to sequential cutting and repositioning operations based on determined cutting locations.