The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2014

Filed:

Jan. 16, 2014
Applicant:

Coretech System Co., Ltd., Hsinchu County, TW;

Inventors:

Rong Yeu Chang, Hsinshu County, TW;

Chia Hsiang Hsu, Hsinchu County, TW;

Chuan Wei Chang, Hsinchu County, TW;

Hsien Sen Chiu, Hsinchu County, TW;

Chao Tsai Huang, Hsinchu County, TW;

Assignee:

Coretech System Co., Ltd., Hsinchu County, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06G 7/50 (2006.01); B29C 45/26 (2006.01); G06F 17/50 (2006.01); B29C 45/76 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
B29C 45/26 (2013.01); G06F 17/5009 (2013.01); B29C 45/7693 (2013.01); B29L 2031/3044 (2013.01);
Abstract

A computer-implemented simulation method for use in molding process by a computer processor includes specifying a simulating domain having a mold cavity configured to connect a tube of a molding machine, creating a mesh by dividing at least part of the simulating domain, generating at least one flow parameter of a molding material in the tube, specifying boundary conditions of the mesh by taking into consideration the at least one flow parameter of the molding material, and simulating a molding process of the molding material that is injected into the mold cavity by using the boundary conditions to generate a plurality of molding conditions.


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