The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2014

Filed:

Apr. 30, 2012
Applicants:

Hiroaki Katsura, Fukui, JP;

Koso Matsuno, Osaka, JP;

Yoji Ueda, Osaka, JP;

Inventors:

Hiroaki Katsura, Fukui, JP;

Koso Matsuno, Osaka, JP;

Yoji Ueda, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 9/00 (2006.01); H01J 11/48 (2012.01); H01J 9/32 (2006.01); H01J 11/10 (2012.01);
U.S. Cl.
CPC ...
H01J 11/10 (2013.01); H01J 11/48 (2013.01); H01J 9/32 (2013.01);
Abstract

An electrode bonding structure sealed with a sealing resin, in which a flexible substrate is bonded to a first substrate via an adhesive, wherein: a region along a bottom face edge of an flexible substrate end part is bonded, via the adhesive, to an inner side region of a region along a top face edge of an first substrate end part; a gap is formed between an inner side region of the region along the bottom face edge of the flexible substrate end part and the region along the top face edge of the first substrate end part; the sealing resin is formed so as to enter, while covering a top face of the flexible substrate end part, at least a portion of the gap; and a height of the gap gets smaller towards the adhesive from the top face edge of the first substrate end part.


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