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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8867227 B1

PDFFull Text
Date of Patent:
Oct. 21, 2014

Filed:

Feb. 23, 2011

Electronic component

Applicants:

Atsushi Watanabe, Osaka, JP;

Seiji Fujiwara, Kyoto, JP;

Inventors:

Atsushi Watanabe, Osaka, JP;

Seiji Fujiwara, Kyoto, JP;

Assignee:

Panasonic Corporation, Osaka, JP;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Tuan T Dinh

Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 7/12 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49562 (2013.01); H01L 2224/29 (2013.01); H01L 2924/01055 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/14 (2013.01); H01L 24/83 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/014 (2013.01); H01L 24/29 (2013.01); H01L 2924/0132 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/0103 (2013.01); H01L 2224/838 (2013.01); H01L 2224/48137 (2013.01); H01L 23/49575 (2013.01); H01L 2924/01033 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/29298 (2013.01); H01L 24/48 (2013.01); H01L 2924/01052 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/49113 (2013.01); H01L 2924/0133 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01014 (2013.01); H01L 24/49 (2013.01); H01L 2224/83385 (2013.01); H01L 2924/01005 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01013 (2013.01); H01L 23/3121 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/00013 (2013.01); H01L 24/45 (2013.01); H01L 24/32 (2013.01); H01L 2224/29111 (2013.01); H01L 23/49513 (2013.01); H01L 2224/48472 (2013.01); H01L 2924/0105 (2013.01); H01L 2224/32057 (2013.01); H01L 2924/157 (2013.01); H01L 2924/01074 (2013.01);
Abstract

An electronic component is mounted on a circuit board. The electronic component includes: a lead frame including a fixed portion, a lead portion connected to the fixed portion, and a heat-dissipating portion connected to the fixed portion; a semiconductor chip fixed on the fixed portion by a first binder; and an encapsulation resin for encapsulating the fixed portion, the semiconductor chip, and a base portion of the lead portion. A groove is provided in the fixed portion and the heat-dissipating portion of the lead frame. The groove extends from a portion of the fixed portion where the first binder is present toward the heat-dissipating portion.

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