The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2014

Filed:

Jan. 29, 2014
Applicant:

Ngk Insulators, Ltd., Aichi-prefecture, JP;

Inventors:

Yuji Hori, Owariasahi, JP;

Ryosuke Hattori, Ichinomiya, JP;

Tomoyoshi Tai, Inazawa, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/08 (2006.01); H03H 9/25 (2006.01); H03H 9/05 (2006.01); H03H 3/08 (2006.01); H03H 3/02 (2006.01); H03H 9/64 (2006.01); H03H 9/145 (2006.01); C04B 37/02 (2006.01);
U.S. Cl.
CPC ...
H03H 9/64 (2013.01); H03H 9/0538 (2013.01); H03H 3/08 (2013.01); H03H 3/02 (2013.01); H03H 9/145 (2013.01); H03H 9/25 (2013.01); C04B 37/02 (2013.01);
Abstract

In a composite substrate, a bonding surfaceof a piezoelectric substrateis an irregular surface which is partially planarized. The irregular surface which is partially planarized includes a plurality of protrusionseach having a flat portionon the tip thereof. The piezoelectric substrateand the supporting substrateare directly bonded to each other at the flat portionsBy forming the bonding surfaceinto an irregular surface (rough surface) and providing flat portionsat the same time, it is possible to secure a sufficient contact area between the piezoelectric substrateand the supporting substrate. Accordingly, in the composite substrate in which the piezoelectric substrateand the supporting substrateare bonded to each other, the bonding surfacecan be roughened and direct bonding can be performed.


Find Patent Forward Citations

Loading…