The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2014

Filed:

Jul. 10, 2013
Applicant:

Panasonic Corporation, Osaka, JP;

Inventors:

Shouichi Kobayashi, Kyoto, JP;

Hiroaki Suzuki, Hyogo, JP;

Kazuhide Uriu, Osaka, JP;

Koichi Seko, Osaka, JP;

Takashi Yui, Shiga, JP;

Kiyomi Hagihara, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/495 (2006.01); H01L 23/538 (2006.01); H01L 29/06 (2006.01); H01L 23/29 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/293 (2013.01); H01L 23/49575 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/32245 (2013.01); H01L 23/495 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/04042 (2013.01); H01L 23/5389 (2013.01); H01L 2225/06513 (2013.01); H01L 29/0657 (2013.01); H01L 2224/48227 (2013.01); H01L 2225/06506 (2013.01); H01L 2224/04105 (2013.01); H01L 2225/0651 (2013.01); H01L 2224/16145 (2013.01); H01L 2225/06568 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/32145 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2924/15311 (2013.01); H01L 2224/73204 (2013.01);
Abstract

A semiconductor device includes a first extended semiconductor chip including a first semiconductor chip and an extension extending outwardly from a side surface of the first semiconductor chip. The semiconductor device also includes a second semiconductor chip mounted above the first extended semiconductor chip and electrically connected with the first semiconductor chip. The first extended semiconductor chip includes a first extension electrode pad provided above the extension and electrically connected with an electrode of the first semiconductor chip.


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