The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2014
Filed:
Jan. 22, 2013
Applicant:
Panasonic Corporation, Osaka, JP;
Inventors:
Yuu Hasegawa, Kagoshima, JP;
Tooru Aoyagi, Kagoshima, JP;
Kenichi Ito, Osaka, JP;
Toshiyuki Fukuda, Kyoto, JP;
Kiyoshi Fujihara, Hyogo, JP;
Masanori Nishino, Kyoto, JP;
Assignee:
Panasonic Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/047 (2006.01); H01L 23/498 (2006.01); H01L 33/48 (2010.01); H01L 27/146 (2006.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 33/486 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 27/14618 (2013.01); H01L 33/62 (2013.01); H01L 23/49548 (2013.01); H01L 23/047 (2013.01); H01L 24/48 (2013.01); H01L 23/49861 (2013.01);
Abstract
A semiconductor device includes: a lead frame; a semiconductor element held by the lead frame; a frame body which is formed on the lead frame to surround the semiconductor element, cover a side surface of the lead frame, and expose a bottom surface of the lead frame; and a protective resin filling a region surrounded by the frame body. The lead frame includes an uneven part formed in a section which is part of an upper surface of the lead frame, and is covered with the frame body.