The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2014
Filed:
Mar. 27, 2012
Hermann Gruber, Woerth a.D., DE;
Joachim Mahler, Regensburg, DE;
Uwe Hoeckele, Regensburg, DE;
Anton Prueckl, Schierling, DE;
Thomas Fischer, Regensburg, DE;
Matthias Schmidt, Munich, DE;
Hermann Gruber, Woerth a.D., DE;
Joachim Mahler, Regensburg, DE;
Uwe Hoeckele, Regensburg, DE;
Anton Prueckl, Schierling, DE;
Thomas Fischer, Regensburg, DE;
Matthias Schmidt, Munich, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
In one embodiment, a method of forming a semiconductor package comprises providing a first die having contact regions on a top surface but not on an opposite bottom surface. A dielectric liner layer is deposited under the bottom surface of the first die. The first die is attached with the deposited dielectric liner layer to a die paddle of a substrate. A bond layer is disposed between the substrate and the dielectric liner layer.