The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2014

Filed:

Sep. 26, 2011
Applicants:

Sachio Higuchi, Hyougo, JP;

Takashi Tanaka, Aichi, JP;

Mitunori Mizoguti, Aichi, JP;

Tsuyoshi Inui, Aichi, JP;

Atsuo Fukuda, Aichi, JP;

Inventors:

Sachio Higuchi, Hyougo, JP;

Takashi Tanaka, Aichi, JP;

Mitunori Mizoguti, Aichi, JP;

Tsuyoshi Inui, Aichi, JP;

Atsuo Fukuda, Aichi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/64 (2010.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/64 (2013.01); H01L 2224/48227 (2013.01); H01L 33/642 (2013.01); H01L 2224/32225 (2013.01); H01L 33/62 (2013.01); H01L 33/486 (2013.01); H01L 2224/73265 (2013.01);
Abstract

An LED module includes: a package having electrodes provided on the outer surface of opposing sidewalls, and a light-emitting element connected to the electrodes and mounted on the package; a base member having a copper metal; an insulating layer stacked on the surface of the base member and having an insulating material; and a conductive wiring pattern connected to the electrodes by soldering and formed on the surface of the insulating layer. The insulating layer has a through-hole formed by removing a part of the section where the package is positioned, and a heat dissipation unit formed by soldering between the back surface of the package and the base member, which face one another with the through-hole interposed therebetween.


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