The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2014
Filed:
Apr. 09, 2010
David Emerson, Chapel Hill, NC (US);
Brian Collins, Raleigh, NC (US);
Michael Bergmann, Chapel Hill, NC (US);
John Edmond, Durham, NC (US);
Eric Tarsa, Goleta, CA (US);
Peter Andrews, Durham, NC (US);
Bernd Keller, Santa Barbara, CA (US);
Christopher Hussell, Cary, NC (US);
Amber Salter, Durham, NC (US);
David Emerson, Chapel Hill, NC (US);
Brian Collins, Raleigh, NC (US);
Michael Bergmann, Chapel Hill, NC (US);
John Edmond, Durham, NC (US);
Eric Tarsa, Goleta, CA (US);
Peter Andrews, Durham, NC (US);
Bernd Keller, Santa Barbara, CA (US);
Christopher Hussell, Cary, NC (US);
Amber Salter, Durham, NC (US);
Cree, Inc., Goleta, CA (US);
Abstract
A light emitter package having increased feature sizes for improved luminous flux and efficacy. An emitter chip is disposed on a submount with a lens that covers the emitter chip. In some cases, the ratio of the width of the light emitter chip to the width of said lens in a given direction is 0.5 or greater. Increased feature sizes allow the package to emit light more efficiently. Some packages include submounts having square dimensions greater than 3.5 mm used in conjunction with larger emitter chips. Materials having higher thermal conductivities are used to fabricate the submounts, providing the package with better thermal management.