The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2014

Filed:

Jan. 12, 2009
Applicants:

Pranabes K. Pramanik, Clifton Park, NY (US);

Yuji Kageyama, Clifton Park, NY (US);

Fujio Kuwako, Clifton Park, NY (US);

Jin Hyun Hwang, Clifton Park, NY (US);

Inventors:

Pranabes K. Pramanik, Clifton Park, NY (US);

Yuji Kageyama, Clifton Park, NY (US);

Fujio Kuwako, Clifton Park, NY (US);

Jin Hyun Hwang, Clifton Park, NY (US);

Assignee:

Oak-Mitsui Technologies LLC, Hoosick Falls, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 7/08 (2006.01); H01G 4/18 (2006.01); H01G 4/20 (2006.01); H01G 4/33 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H01G 4/18 (2013.01); H01G 4/203 (2013.01); H01G 4/33 (2013.01); H05K 1/162 (2013.01); H05K 2201/0166 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/09309 (2013.01);
Abstract

A thin laminate passive electrical device, such as, a capacitor, and a method of fabricating a thin laminate passive electrical device are provided. The passive electrical device includes two conductors, for example, copper foil conductors, separated by a dielectric having a first layer of a first material having a softening point temperature greater than a first temperature and a first layer of a second material having a softening point temperature less than the first temperature. The first temperature may be at least 150 degrees C. or higher. By providing a first layer having a higher softening point material, shorting across the conductors, that can be promoted by the fabrication process, is prevented. Methods of fabricating passive electrical devices are also disclosed.


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